Thermo Pads
NTE's THERMO-PADS do away with the old fashioned mica wafer and conductive grease method of mounting power semiconductors. These thermally conductive insulators offer low heat transfer resistance while still providing high electrical isolation between the parts of the assembly. The elastomeric material combines the electrical isolation of rigid insulators with the ability to conform to rough surfaces and reduce contact resistance in much the same manner as thermal greases. Proper selection and use of these THERMO-PADS results in a securely-mounted power semiconductor and minimum resistance to the heat transfer between it and the heat sink.

Typical Properties
Property 0.009 Inch Thickness Test Method
Construction Silicon/Fiberglass -
Color Gray Visual
Breaking Strength, Lbs./Inch 100 ASTM D 1458
Elongation, Percent 4 ASTM D 412
Volume Resistance Ohm Meter Minimum Normal 1.0 x 1013  
Moist 1.5 x 1010 ASTM D 257
Breakdown Voltage, Minimum Normal 5000  
Moist 2500 ASTM D 149
Dielectric Constant 1000 Cups (Hz) 5.5 ASTM D 150
Continuous Use Temperature, °C -60° to +180° -
Thermal Conductance, W/m-k 0.7 -
Thermal Vacuum Weight Loss Percent (TML), Maximum as Manufactured 0.40 NASA
Post Cure 24 Hrs @ 400°F 0.25 SP-R-0022A
Volatile Condensable Material, Percent, Maximum (CVCM) as Manufactured 0.11 NASA
Post Cure 24 Hrs @ 400°F 0.07 SP-R-0022A
Hardness, Shore A 85 ASTM D 2240
Specific Gravity 2.0 - 2.1 -
Thickness (Expressed in Inches) 0.009 ±0.002 -
Thermal Resistance (TO3 Transistor), °C/Watt 0.50 -

TP0001 TP0002 TP0003 TP0004 TP0005
TP0006 TP0007 TP0008 TP0009 TP0010
 Bar graph of cost per thousand units

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