Lead-Free Wire Solder, 1 lb. Spool | |||||
Flux Type | Kester Part No. | Core Size (Note 1) |
Alloy | Dia. in. | Gauge |
"44" Resin "RA" Activated |
24-0001-0027 | 66 | SN95SB05 | 0.031 | 21 |
24-0096-0026 | 58 | SN96.3AG3.7 | 0.031 | 21 | |
24-7016-0027 | 66 | SN98AG02 | 0.031 | 21 | |
24-7016-0061 | 66 | SN98AG02 | 0.062 | 16 | |
24-7031-0027 | 66 | SN97AG.20SB.80CU2 | 0.031 | 21 | |
24-7040-0018 | 66 | SN96.5AG3.5 | 0.025 | 23 | |
24-7050-0027 | 66 | SN96.3AG3.7 | 0.031 | 21 | |
24-7068-0010 | 66 | SN96.5AG3CU.5 | 0.020 | 25 | |
24-7068-0018 | 66 | SN96.5AG3CU.5 | 0.025 | 23 | |
24-7068-0027 | 66 | SN96.5AG3CU.5 | 0.031 | 21 | |
24-7068-0061 | 66 | SN96.5AG3CU.5 | 0.062 | 16 | |
"48" Resin "RA" Activated |
24-7068-1400 | 66 | SN96.5AG3CU.5 | 0.062 | 16 |
24-7068-1401 | 66 | SN96.5AG3CU.5 | 0.020 | 25 | |
24-7068-1402 | 66 | SN96.5AG3CU.5 | 0.031 | 21 | |
24-7068-1404 | 66 | SN96.5AG3CU.5 | 0.050 | 18 | |
"245" No-Clean Core |
24-7070-8806 | 50 | SN95AG05 | 0.015 | 28 |
"275" No-Clean Core |
24-7068-7601 | 58 | SN96.5AG3CU.5 | 0.031 | 21 |
24-7068-7603 | 66 | SN96.5AG3CU.5 | 0.020 | 25 | |
24-7068-7607 | 58 | SN96.5AG3CU.5 | 0.062 | 16 | |
24-7068-7617 | 58 | SN96.5AG3CU.5 | 0.025 | 23 | |
"285" RMA Core |
24-7080-9711 | 66 | SN95SB05 | 0.062 | 16 |
"331" Water Soluble Core |
24-7068-6401 | 66 | SN96.5AG3CU.5 | 0.020 | 25 |
24-7068-6403 | 66 | SN96.5AG3CU.5 | 0.031 | 21 | |
Acid | 24-7031-2437 | 66 | Aquabond (Note 2) | 0.125 | 11 |
Solid Wire | 14-7016-0125 | N/A | SN98AG02 | 0.125 | 11 |
14-7080-0125 | N/A | SN95/SB05 | 0.125 | 11 | |
14-7080-1001 | N/A | SN95SB05 | 0.093 | 13 | |
14-0000-8053 | N/A | Aquabond (Note 2) | 0.093 | 13 |
Note 1. | Flux Core 50 = 1.1% by weight, Flux Core 58 = 2.2% by weight, Flux Core 66 = 3.3% by weight. |
Note 2. | Aquabond is a Kester trademark for a LEAD-FREE alloy containing: 97%Sn / 2%Cu / 0.8%Sb / 0.2%Ag |