Kester Wire Solder Lead Free - 1lb

Some items may also be available in 5lb spools.

Alloy Conversions:
SN=Tin, PB=Lead, AG=Silver, CU=Copper, SB=Antimony, K100LD=Kester Blend Copper/Tin
  • 44 Flux Core - product description
    • Kester 44 Rosin Flux is an activated rosin formula for use in flux-cored solder wire. 44 has virtually dominated the field of activated rosin core solders for well over four decades. An outstanding performance feature of this flux is the “instant-action” wetting behavior. The high mobility and fast-spreading action of this flux results in more reliable production line soldering. 44 is classified as ROM1 per J-STD-004.
Kester Part No. Alloy Dia. in.
24-0001-0027 SN95SB05 0.031
24-7031-0027 SN97AG.20SB.80CU2 0.031
24-7050-0027 SN96.3AG3.7 0.031
 
Kester Part No. Alloy Dia. in.
24-7040-0027 SN96.5AG3.5 0.031
24-7070-0027 SN95AG05 0.031
  • 48 Flux Core - product description
    • Kester 48 Activated Rosin Flux for cored solder wire was developed for lead-free applications to enable soldering of most common metals. 48 has performance characteristics far exceeding standard RA fluxes. 48 builds on the performance of its predecessor Kester 44 with “instant-action” wetting to provide fast and reliable solder joints. 48 is classified as ROM1 per J-STD-004.
Kester Part No. Alloy Dia. in.
24-7068-1400 SN96.5AG3CU.5 0.062
24-7068-1401 SN96.5AG03CU.5 0.020
24-7068-1402 SN96.5AG3CU.5 0.031
24-7068-1404 SN96.5AG3CU.5 0.050
 
Kester Part No. Alloy Dia. in.
24-7068-1411 SN96.5AG3CU.5 0.093
24-9574-1402 K100LD 0.031
24-9574-1404 K100LD 0.050
  • 285 Flux Core - product description
    • Kester 285 Mildly Activated Rosin Flux is classified as Type ROL0 flux under IPC J-STD-004. This flux was formerly classified as Type RMA per QQ-S-571. 285 consists of high quality, purified rosin to which a synergistic combination of activating agents has been incorporated. The fluxing ability of 285 is much greater than ordinary mildly activated rosin fluxes and is comparable to fully activated rosin fluxes. 285 has been developed for use in the electronic industry where difficult assemblies are to be soldered, but process requirements stipulate use of a mildly activated rosin flux.
Kester Part No. Alloy Dia. in.
24-7050-9710 SN96.3AG3.7 0.031
 
     
     
  • 331 Water Soluble Core - product description
    • Kester 331 Organic Flux is a water-soluble formula for use in flux-cored solder wire. This cored solder version of the popular 2331-ZX Neutral Organic Water Soluble Liquid Flux is more effective than rosin fluxes in soldering difficult metals. The same fast action and mild properties are exhibited with 331 Organic Flux as with the liquid 2331-ZX. The flux is more heat stable than most organic fluxes, resulting in minimal smoke and odor. The residue can be completely removed with a simple heated water rinse. Deionized water is suggested to prevent introduction of chemistries from unknown water sources. 331 is classified as ORH1 per J-STD-004.
Kester Part No. Alloy Dia. in.
24-7068-6403 SN96.5AG3CU.5 0.031
24-7068-6409 SN96.5AG3CU.5 0.050
24-7068-6411 SN96.5AG3CU.5 0.062
 
Kester Part No. Alloy Dia. in.
24-7068-6422 SN96.5AG3CU.5 0.015
24-9574-6403 K100LD 0.031
24-9574-6422 K100LD 0.015
  • 245 No Clean - product description
    • Kester 245 was developed to complement low residue liquid fluxes being used by the electronics industry. The chemistry is based on some of the same principles that have been safely used for years in mildly activated rosin fluxes. The use of 245 results in visually acceptable assemblies without cleaning, yet soldering quality and efficiency is comparable to that obtained with mildly activated rosin flux. 245 is classified as ROL0 per J-STD-004. 245 is Bellcore GR-78 compliant.
Kester Part No. Alloy Dia. in.
24-7040-8800 SN96.5AG03.5 0.031
 
Kester Part No. Alloy Dia. in.
24-7068-8800 SN96.5AG03CU.5 0.031
  • 275 No Clean - product description
    • Kester 275 No-Clean Flux for cored solder wire was developed to provide superior wetting performance for hand soldering in the electronics industry. The chemistry is based on some of the same principles that have been safely used for years in mildly activated rosin fluxes. The use of 275 No-Clean Flux results in an extremely clear post-soldering residue without cleaning. The unique chemistry in 275 was also designed to reduce spattering common to most core fluxes. 275 can be used for both lead bearing and lead-free soldering. 275 is classified as ROL0 per J-STD-004.
Kester Part No. Alloy Dia. in.
24-7068-7600 SN96.5AG3CU.5 0.031
24-7068-7601 SN96.5AG3CU.5 0.031
24-7068-7606 SN96.5AG3CU.5 0.050
24-7068-7607 SN96.5AG3CU.5 0.062
24-7068-7608 SN96.5AG3CU.5 0.015
24-7068-7609 SN96.5AG3CU.5 0.015
 
Kester Part No. Alloy Dia. in.
24-9574-7609 K100LD 0.015
24-9574-7610 K100LD 0.020
24-9574-7615 K100LD 0.062
24-9574-7618 K100LD 0.031
24-9574-7619 K100LD 0.025
  • Solid Wire - product description
    • For soldering applications that require maximum reliability of solder joints, especially for surface mounted components, only solder of the highest purity is acceptable. Only the highest virgin metals are used to make Kester leaded and lead-free solid core wire. Complete analysis of Kester Solder Wire prove that every batch conforms to the strictest quality control standards in the solder industry. Kester leaded and lead-free solid core solder wire meets IPC J-STD-006C. Kester solder wire purchased directly or through Kester stocking distributors will conform to these requirements.
Kester Part No. Alloy Dia. in.
14-0000-8053 Aquabond (Note 1) 0.093
14-7068-0062 SN96.5AG03CU.5 0.062
14-7068-0125 SN96.5AG03CU.5 0.125
 
Kester Part No. Alloy Dia. in.
14-7070-0031 SN95AG05 0.031
14-7080-0125 SN95SB05 0.125
14-7080-1001 SN95SB05 0.093
Note 1. Aquabond is a Kester trademark for LEAD-FREE alloy containing:
97% Sn / 2% Cu / 0.8% Sb / 0.2% Ag.

Lead Free Solder Defined:
On July 1, 2006 the European Union Waste Electrical and Electronic Equipment Directive (WEEE) and Restriction of Hazardous Substances Directive (RoHS) came into effect prohibiting the intentional addition of lead to most consumer electronics produced in the EU. California recently adopted a RoHS law and China has a version as well. Manufacturers in the U.S. may receive tax benefits by reducing the use of lead-based solder.

Lead-free solders in commercial use may contain tin, copper, silver, bismuth, indium, zinc, antimony, and traces of other metals, including lead itself.

The maximum permitted concentrations are 0.1% or 1000 ppm by weight of homogeneous material.





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