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Silicone Heat Sink Compound

NTE303/303A is a non−reactive, silicone, thermally conductive grease with a high thermal conductivityand low thermal resistance with a soft, non−flowable consistancy. The product is formulated with specialty binding agents to achieve the lowest amount of bleed and evaporations. It is designed for applications where a silicone thermal interface material is required and where the device may later need to be easily removed from the heat sink.

Uses:

• Good thermal performance (0.80W/m°k)
• Low interface thermal resistance (0.05°C−In2/W)
• Thin bond lines to ≤1 mil
• Low bleed and evaporation
• Non-toxic
• Reworkable/easy to remove
• Easy to apply by dispensing or screen printing/stencil

Features:

• Non-reactive
• Thermally conductive

Non-Silicone Heat Sink Compound

A grease-like non-silicone, non-migrating material heavily impregnated with heat-conductive metal oxides. This formulation provides high thermal conductivity, low bleed and high temperature stability.

NTE424 has been engineered to solve the problems of contamination and migration associated with silicone-based products. A unique poly synthetic-based thermal grease is used to insure quick, efficient heat transfer and dissipation for the full operational life of your hardware. Will not contaminate solder bath or other devices. Reworkable/easy to remove as well as easy to dispense.

Uses:

• As a high-voltage corona suppressant/non-flammable coating in connections for flyback transformers
• Couples entire heat generating assemblies to chassis
• Mounting semiconductor devices
• Thermoelectric modules
• Heat transfer medium on ballasts
• Thermal joints
• For any devices where cooling is required
• Thermocouple wells
• Mounting power resistors

Features:

• Low interface thermal resistance
• High thermal conductivity/High dielectric strength
• Will not harden, dry out or melt
• Non-toxic
• Meets MIL-C-47113 & MIS-19846 specs