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Call Us: +800-631-1250

Worldwide supplier of high quality electrical / electronic components

Call Us: +800-631-1250

 

ECG Chemicals

Heat Sink Compound

Silicone Heat Sink Compound
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Silicone Heat Sink Compound

Part #: NTE303
Size: 1 Gram Tube
Part #: NTE303A
Size: 1 oz. Plunger

Silicone Heat Sink Compound

NTE303/303A is a non−reactive, silicone, thermally conductive grease with a high thermal conductivityand low thermal resistance with a soft, non−flowable consistancy. The product is formulated with specialty binding agents to achieve the lowest amount of bleed and evaporations. It is designed for applications where a silicone thermal interface material is required and where the device may later need to be easily removed from the heat sink.

Uses:
  • Good thermal performance (0.80W/m°k)
  • Low interface thermal resistance (0.05°C−In2/W)
  • Thin bond lines to ≤1 mil
  • Low bleed and evaporation
  • Non-toxic
  • Reworkable/easy to remove
  • Easy to apply by dispensing or screen printing/stencil

Features:
  • Non-reactive
  • Thermally conductive

Non-Silicone Heat Sink Compound
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Non-Silicone Heat Sink Compound

Part #: NTE424
Size: 1 oz. Plunger

Non-Silicone Heat Sink Compound

A grease-like non-silicone, non-migrating material heavily impregnated with heat-conductive metal oxides. This formulation provides high thermal conductivity, low bleed and high temperature stability.

NTE424 has been engineered to solve the problems of contamination and migration associated with silicone-based products. A unique poly synthetic-based thermal grease is used to insure quick, efficient heat transfer and dissipation for the full operational life of your hardware. Will not contaminate solder bath or other devices. Reworkable/easy to remove as well as easy to dispense.

Uses:
  • As a high-voltage corona suppressant/non-flammable coating in connections for flyback transformers
  • Couples entire heat generating assemblies to chassis
  • Mounting semiconductor devices
  • Thermoelectric modules
  • Heat transfer medium on ballasts
  • Thermal joints
  • For any devices where cooling is required
  • Thermocouple wells
  • Mounting power resistors

Features:
  • Low interface thermal resistance
  • High thermal conductivity/High dielectric strength
  • Will not harden, dry out or melt
  • Non-toxic
  • Meets MIL-C-47113 & MIS-19846 specs